Adhesion and Adhesives, Τόμος 1Elsevier, 1951 |
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Σελίδα 446
... copper , less of the compound is formed than if the tin were there alone . The entire surface of the metal becomes ... copper although lead forms no compound with copper : the adhesion is comparable in amount to the strength of the lead ...
... copper , less of the compound is formed than if the tin were there alone . The entire surface of the metal becomes ... copper although lead forms no compound with copper : the adhesion is comparable in amount to the strength of the lead ...
Σελίδα 448
... copper appear to break Fig . 156. Alloy layer between tin and copper atter tinning for 30 seconds at 450 ° C. Tin ( dark ground ) above Cu , Sn ,, then Cu , Sn , and copper beneath ( × 1000 ) . in the Cu , Sn , layer , but this is ...
... copper appear to break Fig . 156. Alloy layer between tin and copper atter tinning for 30 seconds at 450 ° C. Tin ( dark ground ) above Cu , Sn ,, then Cu , Sn , and copper beneath ( × 1000 ) . in the Cu , Sn , layer , but this is ...
Σελίδα 450
... copper compound , continuing for so long , reduced the tin content of the layer of solder between the copper surfaces and as can be seen from the photomicrographs the proportion of lead was much higher than in the beginning of the tests ...
... copper compound , continuing for so long , reduced the tin content of the layer of solder between the copper surfaces and as can be seen from the photomicrographs the proportion of lead was much higher than in the beginning of the tests ...
Περιεχόμενα
GENERAL CONDITIONS FOR WETTING AND FOR ADHESION | 3 |
MOLECULAR FORCES | 13 |
RHEOLOGY OF ADHESIVES | 52 |
Πνευματικά δικαιώματα | |
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